TAIYO YUDEN Announces Copper Core Embedded-parts Multilayer Wiring Substrate “EOMIN®” with Embedding Capability for Multiple ICs

Contributing to smartphone camera module miniaturization, 20% thinner substrates
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Taiyo Yuden Europe GmbH
Nordring 23
D-90765 Fürth
Telephone: +49 (911) 9364-0
Harald Sauer
Taiyo Yuden EUROPE GmbH
Vertriebsleiter
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